Create Stunning outdoor Gardens with Expert Care
Discover the Art of Sustainable and Beautiful Landscapes
Exceptional Cost Efficiency
Significant cost reduction compared to gold wire, maximizing your production profit.
Superior Conductivity
Outstanding electrical and thermal performance for high-power chip stability.
Ultra-Fine Pitch Ready
Optimized for high-density, miniaturized semiconductor packaging requirements.
Customer Focus
Prioritizing client satisfaction with personalized, attentive service.
Jinan Zunbo CNC Technology Co., Ltd., established in July 2006, is a technology-driven enterprise dedicated to translating research findings from China’s national “863” and “973” programs into practical industrial applications.
- ASTM F72
- ISO 9001
- IATF 16949
Our Services
Palladium-Plated Copper Wire
A high-performance semiconductor packaging material that combines the reliability of gold wire with the cost-effectiveness of copper wire.
Bonding Copper Wire
A high-performance, cost-effective semiconductor packaging solution offering superior conductivity and mechanical stability.
Gold-Plated Palladium-Copper Wire
Gold-wire reliability with copper-core economy: anti-oxidation and high-bonding stability.
Why Us
Precision-Controlled Production Environment
Our Class 10,000 cleanroom ensures constant temperature and humidity, eliminating micro-contaminants to guarantee high consistency for chip-level packaging.
Rigorous Quality Assurance System
Equipped with advanced testing instruments, we perform full-process data tracking—from wire diameter tolerance to tensile strength—ensuring 100% compliance with ASTM international standards.
Flexible Customization Capabilities
Driven by an expert R&D team, we provide rapid, customized solutions for wire diameter and annealing processes to meet specific miniaturized or high-power packaging requirements.
Testimonials
Honest Reviews from our Customers
Jane Anderson
CEO, San Diego
“We have been sourcing Palladium-Plated Copper Wire from this facility for over a year. The wire diameter consistency is exceptional, and we’ve seen a significant reduction in wire sweep issues during our molding process. Their products fully meet our rigorous high-density packaging requirements, offering a reliable and cost-effective alternative to gold wire.”
James Head
CEO, New York City
“The R&D team demonstrated deep expertise in CNC technology and material science. They helped us customize the annealing parameters for a specific high-power device, which greatly improved our bonding yield. Their professional communication and fast lead times make them a highly valued partner in our supply chain.”